1. Fan-out wafer-level packaging /
پدیدآورنده : John H. Lau.
کتابخانه: Center and Library of Islamic Studies in European Languages (Qom)
موضوع : Chip scale packaging.,Circuits and Systems.,Engineering.,Nanotechnology and Microengineering.,Optical and Electronic Materials.,Chip scale packaging.,TECHNOLOGY & ENGINEERING-- Mechanical.
رده :
TK7870
.
17
2. Wafer-Level Chip-Scale Packaging
پدیدآورنده : \ Shichun Qu, Yong Liu
کتابخانه: Library of Foreign Languages and Islamic Sources (Qom)
موضوع : Chip scale packaging.
رده :
E-Book
,
3. Wafer-level chip-scale packaging :
پدیدآورنده : Shichun Qu, Yong Liu.
کتابخانه: Center and Library of Islamic Studies in European Languages (Qom)
موضوع : Chip scale packaging.
رده :
TK7870
.
17
S553
2015
